UFI software version: 1.4.0.1499
Official website:
https://www.ufi-box.com
Official support forum:
https://www.ufixers.com
https://www.martview-forum.com/forums/ufi-box-dongle.183
Official facebook page:
https://www.facebook.com/ufiboxdongle
System info:
Processor: Intel(R) Pentium(R) CPU G2030 2.99 GHz (2 CPUs)
Installed RAM: 3.88 GiB (43 % free)
OS: Windows 7 Ultimate Service Pack 1 (Version 6.1, Build 7601, 64-bit)
Storage:
Disk space: 223.03 GiB (82.94 GiB available)
Disk space(firmware packages): 223.03 GiB (82.94 GiB available)
Loaded drivers:
[zegobit] winusb, version: 1.0.3.2, date: 12-18-2015

Please "Identify eMMC" at first, before any other operation.

UFI Software version 1.4.0.1499
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support site, certain features might not working properly !!!
eMMC ToolBox changes:
ADD: [Oppo] MasterClear in USERAREA PART tab, Special Task
ADD: [Vivo] MasterClear for Qualcomm and MediaTek, Special Task
ADD: New eMMC5x FFU files for eMMC5x Field Firmware Update
MICRON-S0J9K9(16).ffu
SAMSUNG-3H6CAB(210).ffu
SAMSUNG-DH6DAB(210).ffu
SAMSUNG-GD6BMB(5).ffu
BUGFIX: UFI Lite connection issue

BUGFIX: Minor bugfixes and improvements

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5314
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG2e (0x484147326505), rev: 0x07, serial number: 0x0BD8001F
Manufacturing date: Feb 2016
CID: 90014A48 41473265 05070BD8 001F231E
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,762,194,432 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6735, cpu abi: arm64-v8a
manufacturer: Micromax
board: Q417, name: Q417
brand: Micromax, model: Micromax Q417
build model list: Micromax Q417
build id: LMY47D, version: 5.1 Lollipop (MMX_Q417_SW_L100_HW_V1.0_20160107)
build description: full_g3558-user 5.1 LMY47D 1446202623 release-keys
Internal storage: 11.56 GiB
crypto state: unencrypted
Selected: [HYNIX] eNAND H9TQ17ABJTMCUR-KUM/16GB+LPDDR3 16Gb (BGA221)
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5314
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG2e (0x484147326505), rev: 0x07, serial number: 0x0BD8001F
Manufacturing date: Feb 2016
CID: 90014A48 41473265 05070BD8 001F231E
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,762,194,432 bytes)
eMMC 5.x HEALTH report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): 0% - 10% device life time used
Estimation of the device lifetime (MLC): 10% - 20% device life time used