Connection status: EHCI:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-0812
Boot version: 1.04, FW version: 1.10 (Mar 26 2017 14:24:34)
Insertion test... CLK not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x07, serial number: 0xAA16581D
Manufacturing date: May 2015
CID: 90014A48 38473165 0507AA16 581D5260
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 1 MiB
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x50
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
e·MMC 5.x HEALTH report:
Device lifetime: Urgent (Consumed 90% of the reserved block)
Estimation of the device lifetime (SLC): 0% - 10% device life time used
Estimation of the device lifetime (MLC): 0% - 10% device life time used
Selected: [HYNIX] eNAND H26M41103HPR/8GB (BGA153)
factory rest done
Device partitioning completed
but same
how to sloev need halp
