mx6 pasword and factory reset phone dead repair method please

Kayhan

Manufacturing date: AÄŸu 2016

Invalid file name - %s
$00AE10FF UFI.exe TMethodImplementationIntercept
$77938482 KERNEL32.DLL BaseThreadInitThunk
$77D43AB6 ntdll.dll RtlAreBitsSet

$77D43A83 ntdll.dll RtlAreBitsSet

CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJNB4R (0x424a4e423452), rev: 0x07, serial number: 0x2CB4FA05
Manufacturing date: AÄŸu 2016
CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Reading extcsd, size: 512 bytes...
File saved to "\C:\Users\dabee\Desktop\meuzı\ext_csd.bin" (CRC32: 0x7250189F)
Current partition access:
Access to boot partition 1
Reading boot1, size: 4 MiB... Done in 1.524 s
File saved to "\C:\Users\dabee\Desktop\meuzı\boot1.bin" (CRC32: 0x61DAB977)
Blank checking: NOT blank
Current partition access:
Access to boot partition 2
Reading boot2, size: 4 MiB... Done in 1.524 s
File saved to "\C:\Users\dabee\Desktop\meuzı\boot2.bin" (CRC32: 0xE4A59A9E)
Blank checking: NOT blank
Current partition access:
Access to user area
Reading userarea, size: 29.12 GiB... Done in 3 hours 33 mins 58.953 s
File saved to "\C:\Users\dabee\Desktop\meuzı\userarea.bin" Blank checking: NOT blank
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJNB4R (0x424a4e423452), rev: 0x07, serial number: 0x2CB4FA05
Manufacturing date: AÄŸu 2016
CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...

Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJNB4R (0x424a4e423452), rev: 0x07, serial number: 0x2CB4FA05
Manufacturing date: AÄŸu 2016
CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6797, cpu abi: arm64-v8a
manufacturer: Meizu
board: MX6, name: meizu_MX6
brand: Meizu, model: MX6
build id: MRA58K, version: 6.0 Marshmallow (Flyme 6.1.0.0G)
build description: meizu_MX6-user 6.0 MRA58K 1500883154 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KLMBG2JENB-B041/32GB (BGA153)
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJNB4R (0x424a4e423452), rev: 0x07, serial number: 0x2CB4FA05
Manufacturing date: AÄŸu 2016
CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Done.
Done.
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJNB4R (0x424a4e423452), rev: 0x07, serial number: 0x2CB4FA05
Manufacturing date: AÄŸu 2016
CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6797, cpu abi: arm64-v8a
manufacturer: Meizu
board: MX6, name: meizu_MX6
brand: Meizu, model: MX6
build id: MRA58K, version: 6.0 Marshmallow (Flyme 6.1.0.0G)
build description: meizu_MX6-user 6.0 MRA58K 1500883154 release-keys
Internal storage: 3 GiB
crypto state: unencrypted
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KLMBG2JENB-B041/32GB (BGA153)
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJNB4R (0x424a4e423452), rev: 0x07, serial number: 0x2CB4FA05
Manufacturing date: AÄŸu 2016
CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6797, cpu abi: arm64-v8a
manufacturer: Meizu
board: MX6, name: meizu_MX6
brand: Meizu, model: MX6
build id: MRA58K, version: 6.0 Marshmallow (Flyme 6.1.0.0G)
build description: meizu_MX6-user 6.0 MRA58K 1500883154 release-keys
Internal storage: 3 GiB
crypto state: unencrypted
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KLMBG2JENB-B041/32GB (BGA153)
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: BJNB4R (0x424a4e423452), rev: 0x07, serial number: 0x2CB4FA05
Manufacturing date: AÄŸu 2016
CID: 15010042 4A4E4234 52072CB4 FA058390
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6797, cpu abi: arm64-v8a
manufacturer: Meizu
board: MX6, name: meizu_MX6
brand: Meizu, model: MX6
build id: MRA58K, version: 6.0 Marshmallow (Flyme 6.1.0.0G)
build description: meizu_MX6-user 6.0 MRA58K 1500883154 release-keys
Internal storage: 3 GiB
crypto state: unencrypted
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KLMBG2JENB-B041/32GB (BGA153)
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 000000 (0x303030303030), rev: 0x56, serial number: 0x20110726
Manufacturing date: Tem 2011
CID: 15010030 30303030 30562011 0726589C
CSD: 90270132 0F5903FF F6DBFFEF 8A404022
EXT_CSD revision: 1.5 (MMC v4.41)
Partition info:
Boot1: 512 KiB
Boot2: 512 KiB
RPMB: 128 KiB
User area: 16 GiB(17,179,869,184 bytes)
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x03
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
moviNAND: card is run in boot mode.
EXT CSD info:
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: MT6797, cpu abi: arm64-v8a
manufacturer: Meizu
board: MX6, name: meizu_MX6
brand: Meizu, model: MX6
build id: MRA58K, version: 6.0 Marshmallow (Flyme 6.1.0.0G)
build description: meizu_MX6-user 6.0 MRA58K 1500883154 release-keys
crypto state: encrypted?
MTK Preloader file info.
Connection status: XHCI:HUB3:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-8772
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: 000000 (0x303030303030), rev: 0x56, serial number: 0x20110726
Manufacturing date: Tem 2011
CID: 15010030 30303030 30562011 0726589C
CSD: 90270132 0F5903FF F6DBFFEF 8A404022
EXT_CSD revision: 1.5 (MMC v4.41)
Partition info:
Boot1: 512 KiB
Boot2: 512 KiB
RPMB: 128 KiB
User area: 16 GiB(17,179,869,184 bytes)
Change partition size of Boot to 4096 KiB and RPMB to 4096 KiB... Failed to change boot partition size (return code: 1, CMD Error: Timeout)
status: unknown (0)
Change partition size of Boot to 4096 KiB and RPMB to 1024 KiB... Failed to send vendor command (return code: 1, CMD Error: Timeout)
status: unknown (0)
Failed to switch partition to 1, error code: 0
CMD16 error, cmd response: 0x900, card state: 4 (Card is in transfer state)
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
UFI software version: 1.3.0.1156
ldr [winscard] -> 72
Official website:
https://www.ufi-box.com
Official support forum:
https://www.ufixers.com
System info:
Processor: Intel(R) Core(TM) i5-7500 CPU 3.41 GHz (4 CPUs)
Installed RAM: 7.94 GiB (63 % free)
OS: Windows 10 Professional (Version 10.0, Build 17134, Redstone 4(April 2018 Update), 64-bit)
Storage:
Disk space: 340.84 GiB (97.63 GiB available)
Disk space(firmware packages): 589.71 GiB (63.17 GiB available)
Loaded drivers:
[Microsoft] WINUSB, version: 1.1.0.0, date: 8-30-2012
ldr [bxsdk32] -> 104

Please "Identify eMMC" at first, before any other operation.

UFI Software version 1.3.0.1156
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support site, certain features might not working properly !!!
General changes:
Software version numbering changed
ADD: Extract support for RAR5 file format
ADD: System information for Android A/B system is now readed correctly
ADD: Improved reading system information for Android Oreo and Project Treble system
eMMC ToolBox changes:
ADD: eMMC5x Field Firmware Update support
This Field Firmware Update (FFU) is a standart feature introduced to eMMC 5.0 or later
FFU on eMMC5x is slighly different compared to movinand custom ffu, it will not erase data or reset eMMC config.
FFU available via sync:

HYNIX-hB8aP(3).ffu
HYNIX-hDEaP3(2).ffu
MICRON-S0J9D8(167).ffu
MICRON-S0J9F8(16).ffu
SAMSUNG-QE63MB(3).ffu
ADD: Auto list PIT file inside tar.md5 archive on factory image tab
BUGFIX: Minor bugfixes and improvements

BUGFIX: MoviNAND update eMMC firmware was broken on build 1155

EXT CSD info:
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: MT6797, cpu abi: arm64-v8a
manufacturer: Meizu
board: MX6, name: meizu_MX6
brand: Meizu, model: MX6
build id: MRA58K, version: 6.0 Marshmallow (Flyme 6.1.0.0G)
build description: meizu_MX6-user 6.0 MRA58K 1500883154 release-keys
crypto state: encrypted?
+++++++++++++++++++++++++++++++++++++++++++++++++++++

Kayhan

@madgoeslim help me

Kayhan

help me pleasee