how to repair imei qualcom based phone - ufi emmc toolbox?
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.10 (Mar 26 2017 14:24:34)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HAG2e (0x484147326505), rev: 0x07, serial number: 0x6E515996
Manufacturing date: May 2015
CID: 90014A48 41473265 05076E51 5996527E
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,762,194,432 bytes)
Cache size: 1 MiB
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID ROM info:
platform: msm8916, cpu abi: armeabi-v7a
manufacturer: LENOVO
board: msm8916, name: Kraft-A6000
brand: Lenovo, model: Lenovo A6000
build id: LRX22G, version: 5.0.2 Lollipop (Kraft-A6000_S054_150915)
build description: Kraft-A6000-user 5.0.2 LRX22G Kraft-A6000_S054_150915 release-keys
Selected: [HYNIX] eNAND H9TQ17ABJTMCUR-KUM/16GB+LPDDR3 16Gb (BGA221)
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