oppo a3s after format and clear frp mobile stuck in 9008 port
2 mobiles same issue
plz help
UFI software version: 1.3.0.1156
ldr [winscard] -> 136
Official website:
https://www.ufi-box.com
Official support forum:
https://www.ufixers.com
System info:
Processor: Intel(R) Core(TM) i7-2600 CPU 3.39 GHz (8 CPUs)
Installed RAM: 3.17 GiB (51 % free)
OS: Windows 7 Professional Service Pack 1 (Version 6.1, Build 7601, 32-bit)
Storage:
Disk space: 465.66 GiB (223.20 GiB available)
Disk space(firmware packages): 465.66 GiB (223.20 GiB available)
Loaded drivers:
[zegobit] winusb, version: 1.0.3.2, date: 12-18-2015
ldr [bxsdk32] -> 200
Please "Identify eMMC" at first, before any other operation.
UFI Software version 1.3.0.1156
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support site, certain features might not working properly !!!
General changes:
Software version numbering changed
ADD: Extract support for RAR5 file format
ADD: System information for Android A/B system is now readed correctly
ADD: Improved reading system information for Android Oreo and Project Treble system
eMMC ToolBox changes:
ADD: eMMC5x Field Firmware Update support
This Field Firmware Update (FFU) is a standart feature introduced to eMMC 5.0 or later
FFU on eMMC5x is slighly different compared to movinand custom ffu, it will not erase data or reset eMMC config.
FFU available via sync:
HYNIX-hB8aP(3).ffu
HYNIX-hDEaP3(2).ffu
MICRON-S0J9D8(167).ffu
MICRON-S0J9F8(16).ffu
SAMSUNG-QE63MB(3).ffu
ADD: Auto list PIT file inside tar.md5 archive on factory image tab
BUGFIX: Minor bugfixes and improvements
BUGFIX: MoviNAND update eMMC firmware was broken on build 1155
SERVICE & AUX SD-MMC Pinouts:
UFI ISP Adapter:
==========================================
Wrong wiring may results in damaged BOX !!!
Disconnect ISP adapter from the box before soldering !!!
Make sure to use "anti static" soldering iron !!!
For best performace, please use external power DC 5V to the box !!!
[ Open \ISP Pinout picture ]
Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4634
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x06, serial number: 0x44F70662
Manufacturing date: Aug 2018
CID: 15010051 4536334D 420644F7 06628570
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\%BACKUPS%\QE63MB_44F70662.ext_csd"
ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1803
brand: OPPO, model: CPH1803(OPPO A3s)
build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1803EX_11_A.17)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20190323.213841 release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Selected: [SAMSUNG] KMQE60013M-B318/16GB+LPDDR3 16Gb (BGA221)
Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4634
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x06, serial number: 0x44F70662
Manufacturing date: Aug 2018
CID: 15010051 4536334D 420644F7 06628570
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Factory Reset...
Creating filesystem... Done.
Writing cache... Done.
Creating filesystem... Done.
Writing userdata... Done.
Done.
Connection status: EHCI:HUB:HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-4634
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: QE63MB (0x514536334d42), rev: 0x06, serial number: 0x44F70662
Manufacturing date: Aug 2018
CID: 15010051 4536334D 420644F7 06628570
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Clear FRP Lock... Done.
