Connection status: IUSB3HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8843
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA5, serial number: 0x1675380C
Manufacturing date: Oct 2017
CID: 90014A48 42473461 32A51675 380CA4EE
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: MT6763, cpu abi: arm64-v8a
manufacturer: OPPO
board: full_oppo6763_17031, name: CPH1723
brand: OPPO, model: OPPO CPH1723()
build id: N6F26Q, version: 7.1.1 Nougat (CPH1723EX_11_A.29_180819)
build description: full_oppo6763_17031-user 7.1.1 N6F26Q 1534666073 release-keys
crypto state: encrypted?
Selected: [HYNIX] H9TQ26ACLTMCUR/32GB (BGA221)
Connection status: IUSB3HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8843
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA5, serial number: 0x1675380C
Manufacturing date: Oct 2017
CID: 90014A48 42473461 32A51675 380CA4EE
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
crypto state: encrypted?
Selected: [HYNIX] H9TQ26ACLTMCUR/32GB (BGA221)
Connection status: IUSB3HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8843
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 3MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA5, serial number: 0x1675380C
Manufacturing date: Oct 2017
CID: 90014A48 42473461 32A51675 380CA4EE
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory erase... Done.
Reseting PART_CONFIG... Done.
Reseting BOOT_BUS_CONDITIONS... Done.
Connection status: IUSB3HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8843
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA5, serial number: 0x1675380C
Manufacturing date: Oct 2017
CID: 90014A48 42473461 32A51675 380CA4EE
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Selected: [HYNIX] H9TQ26ACLTMCUR/32GB (BGA221)
Connection status: IUSB3HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8843
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA5, serial number: 0x1675380C
Manufacturing date: Oct 2017
CID: 90014A48 42473461 32A51675 380CA4EE
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Current partition access:
Access to boot partition 1
Writing random bytes to boot1, sector: 0... Done in 0.086 s
Verifying... Done in 0.001 s, content verified successfully.
Writing random bytes to boot1, sector: 6962... Done in 0.002 s
Verifying... Done in 0.001 s, content verified successfully.
Current partition access:
Access to user area
Writing random bytes to userarea, sector: 0... Done in 0.001 s
Verifying... Done in 0.001 s, content verified successfully.
Writing random bytes to userarea, sector: 46945503... Done in 0.001 s
Verifying... Done in 0.001 s, content verified successfully.
Connection status: IUSB3HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8843
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA5, serial number: 0x1675380C
Manufacturing date: Oct 2017
CID: 90014A48 42473461 32A51675 380CA4EE
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Selected: [HYNIX] H9TQ26ACLTMCUR/32GB (BGA221)
platform: MT6763
project: oppo6763_17031
storage: HW_STORAGE_EMMC
boot_channel: MSDC_0
block_size: 0x00020000
MTK Preloader file info.
Found 11 supported eMMC CID:
[Samsung] DH6DMB 15010044 4836444D 42xxxxxx xxxxxxxx
[Samsung] RX64MB 15010052 5836344D 42xxxxxx xxxxxxxx
[Samsung] RH64AB 15010052 48363441 42xxxxxx xxxxxxxx
[Samsung] 3H6CMB 15010033 4836434D 42xxxxxx xxxxxxxx
[Samsung] RH64MB 15010052 4836344D 42xxxxxx xxxxxxxx
[Samsung] GD6BMB 15010047 4436424D 42xxxxxx xxxxxxxx
[Samsung] GX6BMB 15010047 5836424D 42xxxxxx xxxxxxxx
[Samsung] GE6BMB 15010047 4536424D 42xxxxxx xxxxxxxx
[Samsung] RD64MB 15010052 4436344D 42xxxxxx xxxxxxxx
[Micron] S0J9B7 13014E53 304A3942 37xxxxxx xxxxxxxx
[SK Hynix] HCG8a4 90014A48 43473861 34xxxxxx xxxxxxxx
Connection status: IUSB3HUB:USB 2.0 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-8843
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done.
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 48MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: HBG4a2 (0x484247346132), rev: 0xA5, serial number: 0x1675380C
Manufacturing date: Oct 2017
CID: 90014A48 42473461 32A51675 380CA4EE
CSD: D0270132 8F5903FF FFFFFFE7 8A400016
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Re-partitioning... Done.
Writing MBR, GPT at 0x00000000-0x000043FF (34 sectors)... Done in 0.007 s
Writing preloader header... Done.
Current partition access:
Access to boot partition 1
Writing preloader at 0x00000000 (497 sectors)... Done in 0.112 s
Writing boot partition config to 0x48... Done.
Processing file: "recovery.img"... Writing recovery at 0x00108000 (37310 sectors)... Done in 7.217 s
Processing file: "md1rom.img"... Writing md1img at 0x12D00000 (56027 sectors)... Done in 10.840 s
Processing file: "md1dsp.img"... Writing md1dsp at 0x16D00000 (12297 sectors)... Done in 2.381 s
Processing file: "spmfw.bin"... Writing spmfw at 0x17D00000 (79 sectors)... Done in 0.015 s
Processing file: "tinysys-sspm.bin"... Writing sspm_1 at 0x17E00000 (697 sectors)... Done in 0.134 s
Processing file: "tinysys-sspm.bin"... Writing sspm_2 at 0x17F00000 (697 sectors)... Done in 0.133 s
Processing file: "lk.bin"... Writing lk at 0x1E000000 (1381 sectors)... Done in 0.266 s
Processing file: "lk.bin"... Writing lk2 at 0x1E100000 (1381 sectors)... Done in 0.265 s
Processing file: "boot.img"... Writing boot at 0x1E200000 (23026 sectors)... Done in 4.457 s
Processing file: "logo.bin"... Writing logo at 0x20200000 (6697 sectors)... Done in 1.294 s
Processing file: "trustzone.bin"... Writing tee1 at 0x20A00000 (884 sectors)... Done in 0.169 s
Processing file: "trustzone.bin"... Writing tee2 at 0x20F00000 (884 sectors)... Done in 0.169 s
Processing file: "cache.img"... Writing sparse image cache at 0x17A000000 (884736 sectors)... Done in 3.503 s
Writing boot partition config to 0x48... Done.
Flash Faild
AUTH info: MTK, version: 1
BROM version[1]: 7.1817.3.0
Loading DA: MTK_AllInOne_DAA[0].bin (514.33 Ki😎
version: 3.3001.2017/09/22019/08/05 18:32:05, start addr: 0x40000800
Connecting to BootROM...
Power off the phone, disconnect and reconnect the battery(if possible) and connect USB cable...
Hold the VOL UP to force MediaTek BootROM.
Scanning BootROM or Preloader port... Done.
Detected MediaTek USB Port_V1632 (COM14)
Connection status: EHCI:HUB:HUB:USB 1.16 High-Speed
USB Driver: [MediaTek Inc.] wdm_usb, version: 3.0.1504.0, date: 1-22-2015
Connecting Bootrom... Done.
Sending Download Agent... failed
Platform: MT6763, Hw ver: 0xCA01, Sw ver: 0x0001
Secure ver: 0x00, BL ver: 0x00
Secure config: 0x00
SRAM size: 256 KiB
DRAM size: 3 GiB
SOC ID: d74b23e57d5d6838bd32498584ae72669b9373cc26a647338f125bdd9a27c0a6
ME ID: 210d8f3c37b495a11ef09e2433d9c605
Error: 3178 (S_DA_INVALID_STORAGE_TYPE)
Error: -1073479671 (STATUS_UNKNOWN_STORAGE_TYPE)
