Connection status: IUSB3HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-3294
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: M8G2FB (0x4d3847324642), rev: 0x08, serial number: 0x4E1BBCE0
Manufacturing date: май 2013
CID: 1501004D 38473246 42084E1B BCE0501C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB
User area: 3.64 GiB(3,909,091,328 bytes)
Cache size: 64 MiB
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
eMMC 5.x HEALTH report:
Device lifetime: Warning (Consumed 80% of reserved block)
Estimation of the device lifetime (SLC): 20% - 30% device life time used
Estimation of the device lifetime (MLC): 20% - 30% device life time used
Detected: SAMSUNG moviNAND KMM8G0002F-BXXX/4G
