SERVICE & AUX SD-MMC Pinouts:
UFI ISP Adapter:
Be very carefully while soldering VCC,VCCQ,CMD,CLK and DATA pins.
Wrong wiring may results in damaged BOX or BRICK your device !!!
Don't use long wire, long wire will result in bad connections !!!
Disconnect ISP adapter from the box before soldering !!!
Make sure to use "anti static" soldering iron !!!
When internal VCC,VCCQ power is used, please use the -
external power DC 5V to the box for best performance.
[ Open \ISP Pinout picture ]
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-3228
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x4F74E85E
Manufacturing date: Oct 2018
CID: 90014A68 43386150 3E034F74 E85EA574
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\%BACKUPS%\hC8aP_4F74E85E.ext_csd"
ANDROID System Info:
platform: sdm660, cpu abi: arm64-v8a
manufacturer: OPPO
board: sdm660, name: RMX1801
brand: OPPO, model: RMX1801 (realme 2 Pro)
build model list: RMX1801 (realme 2 Pro)
build id: PKQ1.181121.001, version: 9 Pie (RMX1801EX_11_C.25)
build description: sdm660_64-user 9 PKQ1.181121.001 eng.root.20191107.030734 release-keys
crypto state: encrypted?
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-3228
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x4F74E85E
Manufacturing date: Oct 2018
CID: 90014A68 43386150 3E034F74 E85EA574
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Factory Reset...
Creating filesystem with parameters:
Size: 268435456
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 1024
Label:
Blocks: 65536
Block groups: 2
Reserved block group size: 15
Created filesystem with 13/16384 inodes and 2091/65536 blocks
Writing cache... Done
Creating filesystem with parameters:
Size: 53921951744
Block size: 4096
Blocks per group: 32768
Inodes per group: 8192
Inode size: 256
Journal blocks: 32768
Label:
Blocks: 13164539
Block groups: 402
Reserved block group size: 1024
Created filesystem with 11/3293184 inodes and 252776/13164539 blocks
Writing userdata... Done
Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-3228
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x4F74E85E
Manufacturing date: Oct 2018
CID: 90014A68 43386150 3E034F74 E85EA574
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Clear FRP Lock... Done
Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-3228
Boot version: 1.04, FW version: 1.12 (Jun 7 2018 00:06:47)
Insertion test... Done
VCCQ not properly connected
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x4F74E85E
Manufacturing date: Oct 2018
CID: 90014A68 43386150 3E034F74 E85EA574
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: sdm660, cpu abi: arm64-v8a
manufacturer: OPPO
board: sdm660, name: RMX1801
brand: OPPO, model: RMX1801 (realme 2 Pro)
build model list: RMX1801 (realme 2 Pro)
build id: PKQ1.181121.001, version: 9 Pie (RMX1801EX_11_C.25)
build description: sdm660_64-user 9 PKQ1.181121.001 eng.root.20191107.030734 release-keys
Internal storage: 50.22 GiB
crypto state: unencrypted
