hi any one had solution for this problem. Redmi note 7 pro struck on logo.
what type of process I done
Received condition - Hand on logo (no recovery)
What I done:
reflash device with latest firmware - no use
erase emmc and flash again - no use
repartitio emmc and write all emmc dump. again flash updated version - no use
it still hang on logo
emmc health shows normal before partition and after partition.
I observed one thing is SLC - not defined in ufi log.
after partition still it shows SLC - not defined.
please any one help. thanks in advance.
Connection status: EHCI:HUB:HUB[#3]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5859
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x325274CC
Manufacturing date: Jun 2019
CID: 90014A68 43386150 3E033252 74CC6640
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 5998]
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 2 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
ANDROID System Info:
platform: sm6150, cpu abi: arm64-v8a
manufacturer: Xiaomi
board: violet, name: violet
brand: xiaomi, model: Redmi Note 7 Pro
build id: QKQ1.190915.002, version: 10 [Android 10] ()
Connection status: EHCI:HUB:HUB[#3]:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5859
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: hC8aP (0x68433861503e), rev: 0x03, serial number: 0x325274CC
Manufacturing date: Jun 2019
CID: 90014A68 43386150 3E033252 74CC6640
CSD: D0270032 8F5903FF FFFFFFEF 8E400042
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4 MiB
Boot2: 4 MiB
RPMB: 16 MiB [Provisioned, counter: 5998]
User area: 58.24 GiB(62,537,072,640 bytes)
eMMC 5.x Health report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): Not defined
Estimation of the device lifetime (MLC): 10% - 20% device life time used
