Connection status: IUSB3HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-6868
Boot version: 1.04, FW version: 1.10 (Mar 26 2017 14:24:34)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x90 (SK Hynix)
Product name: H8G1e (0x483847316505), rev: 0x03, serial number: 0x011AB544
Manufacturing date: Jun 2014
CID: 90014A48 38473165 0503011A B54461B6
CSD: D0270132 0F5903FF FFFFFFEF 8A4040D2
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 7.27 GiB(7,801,405,440 bytes)
GP1: 8 MiB (enhanced)
Cache size: 1 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning completed
Boot configuration protection: 0x00
Boot bus conditions: 0x06
Bus width: x8 (sdr/ddr), boot mode: sdr(default), retain bus width and boot mode
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x80
Password protection features: disabled
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
e·MMC 5.x HEALTH report:
Device lifetime: Urgent (Consumed 90% of the reserved block)
Estimation of the device lifetime (SLC): 0% - 10% device life time used
Estimation of the device lifetime (MLC): Exceeded its maximum estimated device life time
Selected: [HYNIX] eNAND H9TP64A8JDMCPR-KGM/8GB (FBGA162)
this emmc possible to repair
plz guide me
