Indentify eMMc:
Interface: UFI High-Speed
Serial number:
Boot version: 1.04, FW version: 1.10 (Mar 26 2017 14:24:34)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RX14MB (0x525831344d42), rev: 0x00, serial number: 0x6139AC23
Manufacturing date: июл 2016
CID: 15010052 5831344D 42006139 AC2373CC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

Dump eMMC FW
Connection status: EHCI:HUB:HUB:USB 2.00 High-speed
Boot version: 1.04, FW version: 1.10 (Mar 26 2017 14:24:34)
Insertion test... Done.
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (SDR 8MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: RX14MB (0x525831344d42), rev: 0x00, serial number: 0x6139AC23
Manufacturing date: июл 2016
CID: 15010052 5831344D 42006139 AC2373CC
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)

moviNAND dumping RAM...
RAM dump resulted blank memory !
RAM dump resulted blank memory !