madgoeslim
thanks for your replay
finally i got sucsess with chip off method
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GE6BMB (0x474536424d42), rev: 0x03, serial number: 0xF17C68A1
Manufacturing date: Dec 2017
CID: 15010047 4536424D 4203F17C 68A1C454
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
User area write protection: 0x10
Password protection features: enabled
Power-on write protection: possible
Permanent write protection: not possible
Lock status: not locked
EXT_CSD backup saved to "\%BACKUPS%\GE6BMB_F17C68A1.ext_csd"
Internal storage: 32 MiB
crypto state: unencrypted
ANDROID System Info:
platform: , cpu abi: arm64-v8a
manufacturer: FIH
board: D1C_00WW_FIH, name: D1C_00WW_FIH
brand: FIH, model: FIH-D1C-FIH
build model list: FIH-D1C-FIH
build id: PKQ1.181105.001, version: 7.0 Nougat (00WW_6_18A)
build description: TA-1024_00WW-user 9 PKQ1.181105.001 00WW_6_18A release-keys
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGE6000BM-BXXX/16G
Connection status: XHCI:HUB3:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8839-6952
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 24MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GE6BMB (0x474536424d42), rev: 0x03, serial number: 0xF17C68A1
Manufacturing date: Dec 2017
CID: 15010047 4536424D 4203F17C 68A1C454
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.56 GiB(15,634,268,160 bytes)
Clear FRP Lock... Done
