SAMSUNG moviNAND KMGD6000BM-BXXX/32G - Factory erase... failed! - UFIXERS Community

SAMSUNG moviNAND KMGD6000BM-BXXX/32G - Factory erase... failed!

Dineshras

Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\%BACKUPS%\GD6BMB_63B407D8.ext_csd"
ANDROID System Info:
platform: MT6737H, cpu abi: arm64-v8a
manufacturer: TECNO
board: H3721A1, name: H3721A1
brand: TECNO, model: TECNO IN5
build model list: TECNO IN5
build id: NRD90M, version: 7.0 Nougat (IN5-H3721A-N-IN-180621V128)
crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
eMMC 5.x HEALTH report:
Device lifetime: Normal
Estimation of the device lifetime (SLC): 0% - 10% device life time used
Estimation of the device lifetime (MLC): 0% - 10% device life time used
moviNAND Smart report:
Error Mode: 0x00000000 (Invalid)
Smart report in MMC5x has changed and not supported for this device(use eMMC 5.x HEALTH report instead).
+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++
UFI software version: 1.4.0.1502
Official website:
https://www.ufi-box.com
Official support forum:
https://www.ufixers.com
https://www.martview-forum.com/forums/ufi-box-dongle.183
Official facebook page:
https://www.facebook.com/ufiboxdongle
System info:
Processor: Intel(R) Pentium(R) CPU P6200 2.14 GHz (2 CPUs)
Installed RAM: 2.80 GiB (59 % free)
OS: Windows 7 Ultimate Service Pack 1 (Version 6.1, Build 7601, 32-bit)
Storage:
Disk space: 297.99 GiB (169.22 GiB available)
Disk space(firmware packages): 297.99 GiB (169.22 GiB available)
Loaded drivers:
[zegobit] winusb, version: 1.0.3.2, date: 12-18-2015

Please "Identify eMMC" at first, before any other operation.

UFI Software version 1.4.0.1502
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support site, certain features might not working properly !!!
eMMC ToolBox changes:
ADD: Added 16MB & 32MB preset for Boot and RPMB size change
ADD: [Vivo] MasterClear in USERAREA PART tab, Special Task
ADD: [Oppo] MasterClear in USERAREA PART tab, Special Task
ADD: New eMMC5x FFU files for eMMC5x Field Firmware Update
MICRON-S0J9K9(16).ffu
SAMSUNG-3H6CAB(210).ffu
SAMSUNG-DH6DAB(210).ffu
SAMSUNG-GD6BMB(5).ffu
BUGFIX: UFI Lite connection issue

BUGFIX: Minor bugfixes and improvements

Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 3MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory erase... failed!
Reseting PART_CONFIG... Done
Reseting BOOT_BUS_CONDITIONS... Done
moviNAND Factory Reset... Done
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Current partition access:
Access to boot partition 1
Erasing boot1 data... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
Current partition access:
Access to boot partition 2
Erasing boot2 data... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
Current partition access:
Access to user area
Erasing userarea data... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Current partition access:
Access to boot partition 1
Blank checking boot1 (8192 sectors)... non-blank at 0x00000000: data [ 45 4d 4d 43 ]
Current partition access:
Access to boot partition 2
Blank checking boot2 (8192 sectors)... Done in 0.263 s, content is blank
Current partition access:
Access to user area
Blank checking userarea (61071360 sectors)... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
--- Try to decrease the clock speed ---
--- Make sure the connection between BOX and eMMC stable ---
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G

madgoeslim

EXT_CSD revision: 1.8 (MMC v5.1)

Custom moviNAND command is not supported for this device(MMC51).

Factory erase is cudtom movinand command, and will not work for emmc with ext_csd revision 1.8,
Erase manual instead of using factory erase, to config boot, you can use ext_csd file.

km420

how to solve

Connection status: EHCI:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8842-3460
Boot version: 1.05, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: K7XVMB (0x4b3758564d42), rev: 0x01, serial number: 0x1735DA6A
Manufacturing date: Jul 2014
CID: 1501004B 3758564D 42011735 DA6A7144
CSD: D0270132 0F5903FF F6DBFFEF 8E406068
Permanent write protection enabled
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 512 KiB
User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
EXT_CSD backup saved to "\%BACKUPS%\K7XVMB_1735DA6A.ext_csd"
eMMC 5.x HEALTH report:
Device lifetime: Warning (Consumed 80% of reserved block)
Estimation of the device lifetime (SLC): 10% - 20% device life time used
Estimation of the device lifetime (MLC): 10% - 20% device life time used
Selected: [SAMSUNG] moviNAND KMK7X000VM-B314/8GB+LPDDR2 8Gb(x32) (BGA162

uzzal

some problem
what is solusion

jbbasha76

i have the same issue with a7 cph1901 cant reset phone is working only lock issue

Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8841-0417
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 1.8 V
Bus: 1 bit (SDR 4MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GP6BMB (0x475036424d42), rev: 0x01, serial number: 0x2C65AAD4
Manufacturing date: Sep 2018
CID: 15010047 5036424D 42012C65 AAD4950C
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 16384 KiB
User area: 58.24 GiB(62,537,072,640 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x38
No boot acknowledge is sent (default)
User area is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked

ANDROID System Info:
platform: msm8953, cpu abi: arm64-v8a
manufacturer: OPPO
board: msm8953, name: CPH1901
brand: OPPO, model: CPH1901 (OPPO A7)
build model list: CPH1901 (OPPO A7)
build id: OPM1.171019.026, version: 8.1.0 Oreo (CPH1901EX_11_A.20)
build description: msm8953_64-user 8.1.0 OPM1.171019.026 eng.root.20201124.222340 release-keys

crypto state: encrypted?
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGP6000BM-BXXX/64G

cant format r master clear cant do nothing even cant flash also

madgoeslim

km420 Permanent write protection enabled

Hi, you may disable permanent write protection using Disable PERM_WRITE_PROTECT button.
If this function not work, try to update FFU. If problem remain, then chip is useless.