Please "Identify eMMC" at first, before any other operation.

UFI Software version 1.4.0.1502
Whats new:
!!! WARNING: Do not rename "BRAND" and "MODEL" list to be different as at support site, certain features might not working properly !!!
eMMC ToolBox changes:
ADD: Added 16MB & 32MB preset for Boot and RPMB size change
ADD: [Vivo] MasterClear in USERAREA PART tab, Special Task
ADD: [Oppo] MasterClear in USERAREA PART tab, Special Task
ADD: New eMMC5x FFU files for eMMC5x Field Firmware Update
MICRON-S0J9K9(16).ffu
SAMSUNG-3H6CAB(210).ffu
SAMSUNG-DH6DAB(210).ffu
SAMSUNG-GD6BMB(5).ffu
BUGFIX: UFI Lite connection issue

BUGFIX: Minor bugfixes and improvements

Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x48
Boot acknowledge is sent during the boot operation
Boot partition 1 is enabled for boot
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 3MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Factory erase... failed!
Reseting PART_CONFIG... Done
Reseting BOOT_BUS_CONDITIONS... Done
moviNAND Factory Reset... Done
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Current partition access:
Access to boot partition 1
Erasing boot1 data... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
Current partition access:
Access to boot partition 2
Erasing boot2 data... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
Current partition access:
Access to user area
Erasing userarea data... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Current partition access:
Access to boot partition 1
Blank checking boot1 (8192 sectors)... non-blank at 0x00000000: data [ 45 4d 4d 43 ]
Current partition access:
Access to boot partition 2
Blank checking boot2 (8192 sectors)... Done in 0.263 s, content is blank
Current partition access:
Access to user area
Blank checking userarea (61071360 sectors)... cmd response: 0x2000900, card status: 0x2000000, card state: 4 (Card is in transfer state)
status: The card is locked by the host
--- Try to decrease the clock speed ---
--- Make sure the connection between BOX and eMMC stable ---
Connection status: EHCI:HUB:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-5166
Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: GD6BMB (0x474436424d42), rev: 0x01, serial number: 0x63B407D8
Manufacturing date: Feb 2018
CID: 15010047 4436424D 420163B4 07D82596
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 29.12 GiB(31,268,536,320 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
Custom moviNAND command is not supported for this device(MMC51).
Detected: SAMSUNG moviNAND KMGD6000BM-BXXX/32G